The SkyHigh Memory® S34MS16G2 16-Gb NAND is offered in 1.8V VCC with x8 I/O interface. This document contains information for the S34MS16G2 device, which is a quad-die stack of four S34MS04G2 die. For detailed specifications, please refer to the discrete die data sheet: S34MS01G2_04G
The SkyHigh Memory® S34MS08G2 8-Gb NAND is offered in 1.8VCC with x8 I/O interface. This document contains information for the S34MS08G2 device, which is a dual-die stack of two S34MS04G2 die.
The SkyHigh Memory S34MS01G2, S34MS02G2, and S34MS04G2 series is offered in 1.8 VCC and VCCQ power supply, and with x8 or x16 I/O interface. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. The page size for x8 is (2048 + spare) bytes; for x16 (1024 + spare) words.
The SkyHigh Memory S34MS01G2, S34MS02G2, and S34MS04G2 series is offered in 1.8 VCC and VCCQ power supply, and with x8 or x16 I/O interface. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. The page size for x8 is (2048 + spare) bytes; for x16 (1024 + spare) words.
The SkyHigh Memory S34MS01G2, S34MS02G2, and S34MS04G2 series is offered in 1.8 VCC and VCCQ power supply, and with x8 or x16 I/O interface. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. The page size for x8 is (2048 + spare) bytes; for x16 (1024 + spare) words.
AN98544 describes the features and parameters of the SkyHigh NAND PDD to unlock the maximum potential for SkyHigh NAND devices in Windows Embedded platforms.
Power fault tolerance is a requirement of any modern system using flash. It is largely accomplished by software/firmware managing the flash. This application note describes a method of connecting the flash to improve the system's power fault tolerance.
AN200508 details how to migrate designs from SkyHigh S34MS-1 (S34MS01G1, S34MS02G1, S34MS04G1, and S34MS08G1) NAND flash memory devices to SkyHigh S34MS-2 (S34MS01G2, S34MS02G2, S34MS04G2, and S34MS08G2) NAND flash memory devices.
AN203229 describes the steps involved in preparing a master “golden” image that can be used to program multiple NAND devices for the same platform or product.
AN218226 shows how to create a product that uses a single flash image with SLC NAND flash from multiple suppliers, where a SkyHigh flash part with 64B or 128B spare area is used with another compatible NAND flash device with a different spare area size. Required changes are shown for the general case. Modifications to the Linux MTD are provided to illustrate one of the required changes for Linux-based systems.
AN98527 discusses the X-ray inspection test conditions and recommendations for SkyHigh NOR/SPI/NAND Flash products that should be used to prevent damage to ICs.
AN202751 provides guidelines on surface mount assembly for SkiHigh’s Fine Pitch Ball Grid Arrat(FBGA) packages, printed circuit board(PCB) design, surface mount process flow, and final joint inspection methods.