| AN98527 X-Ray Inspection Test Conditions for Cypress NOR/SPI/NAND Flash |
English |
287 KB |
*D |
06/03/2019 |
- Issue Date :
- 07/11/2012
AN98527 discusses the X-ray inspection test conditions and recommendations for SkyHigh NOR/SPI/NAND Flash products that should be used to prevent damage to ICs.
|
| AN99178 SolderMaskandTrace RecommendationsforFBGAs |
English |
408 KB |
*C |
06/03/2019 |
- Issue Date :
- 11/14/2017
AN99178 provides recommendations for solder masks used with FBGAs and escape considerations for traces.
|
| AN201006 Thermal Considerations and Parameters |
English |
445 KB |
*D |
05/29/2019 |
- Issue Date :
- 04/27/2011
AN201006 discusses the thermal considerations and parameters when using SkyHigh devices in printed wiring board(PWB) geometrics.
|
| AN201106 Long Term Storage of Packaged Semiconductor IC Products |
English |
302 KB |
*C |
06/04/2019 |
- Issue Date :
- 09/02/2011
AN201106 Provides information on long-term storage of packaged semiconductor IC products.
|
| AN202751 Surface Mount AssemblyRecommendations for Cypress FBGA Packages |
English |
913 KB |
*C |
05/31/2019 |
- Issue Date :
- 06/30/2015
AN202751 provides guidelines on surface mount assembly for SkiHigh’s Fine Pitch Ball Grid Arrat(FBGA) packages, printed circuit board(PCB) design, surface mount process flow, and final joint inspection methods.
|